超声辅助制备牦牛肉活性肽-壳聚糖基包合物的特性OA
Ultrasound-Assisted Preparation and Properties of Chitosan Inclusion Complex of Yak Meat-Derived Active Peptides
低分子质量肽具有良好的溶解性,且易与自由基结合,减轻脂质过氧化造成的氧化损伤.对牦牛肉进行酶解,经过超滤纯化,制备分子质量≤1 kDa的牦牛肉小分子肽(yak meat-derived small molecular peptides,YMSMPs).由于YMSMPs胃部消化期间稳定性较差,无法到达肠道发挥作用.因此,以壳聚糖(chitosan,CS)-阿拉伯胶(gum arabic,GA)-海藻酸钠(sodium alginate,SA)为壁材,通过超声辅助对YMSMPs进行包合,制备YMSMPs-CS-GA-SA包合物,显著提高其消化稳定性,其溶解度达96.80%.体外模拟消化后,YMSMPs-CS-GA-SA包合物在胃消化和肠消化结束时的累计释放率分别为35.57%和90%,且经肠道消化后表现出比YMSMPs更强的抗氧化能力.CS-GA-SA包合有效延缓了YMSMPs在胃肠道中的释放,且为YMSMPs提供了有效的递送方案.
Low molecular mass peptides have good solubility and are easily bound to free radicals,reducing oxidative damage caused by lipid peroxidation.In this study,yak meat was digested by simulated digestive juices.Yak meat-derived small molecular peptides(YMSMPs)≤1 kDa were prepared from the digest by ultrafiltration and purification.Due to their poor gastric stability,YMSMPs were unable to reach the intestinal tract to exert their effects.To improve their digestive stability,YMSMPs were encapsulated using a mixture of chitosan(CS),gum arabic(GA),and sodium alginate(SA)as the wall material with ultrasonic assistance.The solubility of the prepared inclusion complex(YMSMPs-CS-GA-SA)was 96.80%.After in vitro simulated gastric and intestinal digestion,its cumulative release rates were 35.57%and 90%,respectively.In addition,the intestinal digestate exhibited stronger antioxidant capacity than YMSMPs.The encapsulation effectively delayed the release of YMSMPs in the simulated gastrointestinal tract,providing a delivery scheme for YMSMPs.
张梦杰;赵改名;白雪原;王可;祝超智;殷满财;张新军
河南农业大学食品科学技术学院,河南 郑州 450002河南农业大学食品科学技术学院,河南 郑州 450002河南农业大学食品科学技术学院,河南 郑州 450002河南农业大学食品科学技术学院,河南 郑州 450002河南农业大学食品科学技术学院,河南 郑州 450002大通综合试验站,青海 西宁 810100中卫综合试验站,宁夏 中卫 755000
轻工纺织
体外消化小分子肽抗氧化性超声波多糖包合
in vitro digestionsmall molecular peptidesantioxidant propertiesultrasoundpolysaccharides encapsulation
《肉类研究》 2026 (11)
38-47,10
财政部和农业农村部:国家现代农业产业(肉牛牦牛)技术体系建设专项(CARS-37)河北省现代农业产业(肉牛)技术体系创新团队建设项目(HBCT2023190204)宁夏回族自治区重点研发计划项目(2024BBF02020)
评论