空心玻璃微珠填充环氧树脂固化动力学模型研究OA

A systematic study was conducted on the curing behavior of hollow glass microsphere-filled epoxy res-in systems through experiments and kinetic modeling.Initially,non-isothermal DSC experiments were performed to investigate the influence of heating rates on curing exothermic reactions.Results demonstrate that with increasing heat-ing rates,the exothermic peak shifts to higher temperatures,accompanied by enhanced peak width and magnitude,el-evated heat flow,and accelerated reaction rates.Fitting analyses using n-order reaction and autocatalytic kinetic models reveal superior agreement of experimental data with the autocatalytic model across various heating rates.Sub-sequently,isothermal DSC experiments at 50℃,70℃,75℃,and 90℃were conducted to analyze curing processes under constant temperatures.The results indicate significant acceleration of reaction rates at elevated temperatures in hollow glass microsphere-filled epoxy systems,though complete conversion(100％)remained unattainable due to dif-fusion-controlled reaction stages.Comparatively,sluggish curing kinetics and lower conversion degrees were observed at lower temperatures.By integrating Kamal model fitting with isothermal data,a comprehensive kinetic equation for isothermal curing was established.