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氮化铝HTCC基板微波性能和可靠性研究OA

A Study on Microwave Performance and Reliability of AlN HTCC Substrate

中文摘要英文摘要

介绍了氮化铝(AlN)高温共烧陶瓷(HTCC)微波基板的典型结构形式,研究了基板的介电性能、微波传输性能,并进一步开展了环境试验及可靠性研究.研究结果表明,在微波频率下,AlN HTCC基板具有较低的介电常数和介电损耗,可以满足微波基板的设计要求;基板在经过高温贮存、温度循环、热冲击和湿热试验后,其相关技术性能均未出现恶化或退化现象;湿热试验后,基板的金属膜层和基材部分有轻微的腐蚀改变;盐雾试验后,基板镀金金属膜层的保护评级为8级~9级,有一定的腐蚀现象,因此不建议裸露在潮湿和盐雾环境中使用.文中的研究结果为雷达高功率微波模块或组件的设计和研制提供了依据,且已实现了工程化应用.

The typical structure of aluminum nitride(AlN)high-temperature co-fired ceramic(HTCC)microwave substrate is in-troduced in this paper,and dielectric properties and microwave transmission performance of the substrate are investigated,followed by environmental tests and reliability studies.The results indicate that AlN HTCC substrate exhibits low dielectric constant and die-lectric loss at microwave frequencies,meeting the design requirements for microwave substrate.After undergoing high-temperature storage,thermal cycling,thermal shock and damp heat tests,the relevant technical performance of the substrate shows no signs of deterioration or degradation.However,slight corrosion is observed on the metal film layer and parts of the substrate material follow-ing the damp heat test.After the salt spray test,the protection rating of the gold-plated metal film layer is between grade 8 and grade 9,indicating some corrosion;therefore,exposures to humid and salt fog environments are not recommended.The research findings in this paper provide a basis for the design and development of radar high-power microwave modules or components and have already been implemented in engineering applications.

吕安国;侯清健;张兆华

南京电子技术研究所,江苏南京 210039南京电子技术研究所,江苏南京 210039南京电子技术研究所,江苏南京 210039

信息技术与安全科学

氮化铝高温共烧陶瓷介电性能微波传输性能可靠性试验

aluminum nitride(AlN)high-temperature co-fired ceramic(HTCC)dielectric propertiesmicrowave transmission performancereliability tests

《现代雷达》 2026 (9)

98-103,6

国防科工局基金资助项目

10.16592/j.cnki.1004-7859.2025007

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