Cu、Mg含量对Al-20Si合金组织与热学性能的影响OA

In order to get aluminum-silicon alloys with low thermal expansion and high thermal conductivity,the effects of different Cu and Mg contents added to an Al-20Si alloy were investigated.The results showed that in the Al-20Si alloy,as the Cu content increased,the coefficient of thermal expansion,thermal conductivity,and electrical conductivity of the alloy all exhibited a decreasing trend,while the microhardness gradually increased.In the Al-20Si-2Cu alloy,as the Mg content increased,the coefficient of thermal expansion and the hardness showed an increasing trend,while the thermal and electrical conductivities decreased.When the Cu content was 2%and the Mg content was 0.3%in the Al-20Si alloy,a low-expansion,high-thermal-conductivity aluminum-silicon alloy with an expansion rate of 18.81×10-6 K-1 and a thermal conductivity of 132.55 W/(m·K)was successfully prepared.