印制电路板组件装配三维数字化工艺设计研究OA
Research on 3D Digital Process Planning for Printed Circuit Board Assembly
三维数字化工艺设计是实现产品全生命周期实时数据联动的关键,对提升协同效率、消除数据孤岛、增强文件可视化效果有重要作用.在印制电路板组件(Printed Circuit Board Assembly,PCBA)装配过程中,回流焊接、手工焊接等工序的特殊性和复杂性使得机械加工行业的三维数字化工艺设计平台难以适用于电子产品的生产制造.为了解决这一问题,围绕PCBA装配过程的工艺设计,重点阐述了实现数字化工艺设计的关键技术,包括基于OpenGL的三维建模技术、回流焊接仿真技术、基于强化学习的工艺参数优化技术等.实践表明,通过解析电子设计自动化(Electronic Design Automation,EDA)输出的设计文件可以获取搭建PCBA三维模型所需的所有信息,进而将模型作为核心载体贯穿设计制造全生命周期,从而实现数据驱动的全流程动态协同.
3D digital process planning is the key to realize real time data linkage across the entire product life-cycle,which plays an important role in improving collaboration efficiency,eliminating data silos,and enhancing document visualization.In the process of printed circuit board assembly(PCBA),the particularity and complex-ity of processes such as reflow soldering and manual soldering make it difficult for the 3D digital process design platform in the mechanical processing industry to be applied to the production and manufacturing of electronic products.To address this problem,the key technologies for achieving digital process planning in the assembly process of PCBA are emphasized,including 3D modeling technology based on OpenGL,reflow soldering simu-lation technology,and process parameter optimization technology based on reinforcement learning.Practice shows that all information required for constructing the 3D model of PCBA can be obtained by parsing design files output by electronic design automation(EDA).Thus,the model can be used as the core carrier through the entire design and manufacturing lifecycle,realizing data-driven full-process dynamic collaboration.
杨昌霖
中国航空工业集团公司西安航空计算技术研究所 生产部,陕西 西安 710076
信息技术与安全科学
印制电路板组件数字化工艺设计OpenGL三维建模强化学习工艺优化
PCBAdigital process planning3D modeling based on OpenGLreinforcement learningprocess optimization
《测控技术》 2026 (9)
60-68,9
国家重点研发计划"高性能计算"重点专项(2025YFB3003401)
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