Thermal Utilization on ChipOA
Thermal Utilization on Chip
Yaohao Zhang;Bo Lai;Fei Yu;Xuesong Li;Yue Yang;Wei Lü;Ke Jiang;Xiaojuan Sun;Dabing Li
State Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,China||Key Laboratory of Advanced Structural Materials,Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science,Changchun University of Technology,Changchun,ChinaState Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,ChinaKey Laboratory of Advanced Structural Materials,Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science,Changchun University of Technology,Changchun,ChinaKey Laboratory of Advanced Structural Materials,Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science,Changchun University of Technology,Changchun,ChinaKey Laboratory of Advanced Structural Materials,Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science,Changchun University of Technology,Changchun,ChinaState Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,China||Key Laboratory of Advanced Structural Materials,Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science,Changchun University of Technology,Changchun,ChinaState Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,ChinaState Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,ChinaState Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,China||Center of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing,China
《光：科学与应用（英文版）》 2026 (8)
2871-2883,13
This work was supported by the National Natural Science Foundation of China(62425408,62121005,62474024,U22A2084),the Youth Innovation Promotion Association of the Chinese Academy of Sciences(2023223).
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