首页|期刊导航|中国农机化学报|基于激光切割技术疏除猕猴桃花蕾的试验与分析

基于激光切割技术疏除猕猴桃花蕾的试验与分析OA

Experiment and analysis of removing kiwifruit flower bud based on laser cutting technology

中文摘要英文摘要

为研发快速、精准、劳动强度低的自动疏花疏蕾装备,验证激光烧蚀花梗实现猕猴桃花蕾疏除的可行性,利用激光技术在猕猴桃果园进行猕猴桃花蕾疏除试验.研究以种植于陕西省眉县的徐香、金福、海沃德猕猴桃为试验对象,利用二极管激光器烧蚀猕猴桃花侧蕾花梗部组织进行疏蕾试验;对试验对象激光作业后及间隔 48 h 后的生长状态分别进行拍照记录并测定花梗直径与烧蚀伤口深度;运用数据拟合及多因素方差分析等方法得出 20 W 二极管激光器疏除猕猴桃花蕾以 1.2 s 激光照射时间即激光器输出能量为 24 J 最为适宜;综合不同激光入射方式的疏蕾效果和果园复杂的作业环境选定激光斜向入射的激光器作业姿态;还对激光疏花作业所面临的问题如花蕾附着水分和因风扰动等进行分析和讨论.试验证明利用激光切割技术进行猕猴桃花蕾的疏除是可行的,该研究可为自动激光疏花疏蕾装备的研发提供参考.

To develop automatic flower thinning and bud thinning equipment that is fast,precise,and requires low labor intensity,and to verify the feasibility of kiwifruit flower bud thinning by laser ablating the flower stalk,this study conducted kiwi flower bud thinning experiments in kiwi orchards using laser technology.The research focused on three kiwi varieties—Xu Xiang,Jin Fu,and Hayward—planted in Meixian County,Shaanxi Province.A diode laser was used to ablate the flower stalk tissue of the kiwi flower buds for the thinning experiment.Growth conditions of the test subjects were photographed and recorded before and 48 hours after the laser treatment,and measurements of flower stalk diameter and ablation depth were taken.Data fitting and multi-factor analysis of variance indicated that a 20 W diode laser with a 1.2 s exposure time(24 J output energy)was most suitable for thinning kiwi flower buds.The study also selected a laser with an oblique incident angle based on its thinning effects and the complex orchard working environment.Additionally,issues faced by laser thinning operations,such as moisture on buds and wind disturbances,were analyzed and discussed.The experiment demonstrated that laser cutting technology is feasible for thinning kiwi flower buds and provides a reference for the development of automatic laser flower and bud thinning equipment.

王琛;张玉飞;唐寅;石复习

西北农林科技大学机械与电子工程学院,陕西 杨凌,712100西北农林科技大学机械与电子工程学院,陕西 杨凌,712100西北农林科技大学机械与电子工程学院,陕西 杨凌,712100西北农林科技大学机械与电子工程学院,陕西 杨凌,712100

农业科技

激光切割猕猴桃疏蕾全因子试验果园机械化

laser cuttingkiwifruitbud thinningfull factorial experimentorchard mechanization

《中国农机化学报》 2026 (7)

71-77,7

陕西省重点产业创新链项目(2024NC—ZDCYL—05-10)

10.13733/j.jcam.issn.2095-5553.2026.07.010

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