基于3D打印的晶舟缺片检测传感器研究OA

To address the problem of detecting missing wafers in wafer cassettes within semiconductor production lines,the research group designed a 3D-printed flexible contact-based missing-wafer detection sensor.The sensor operates on the piezoresistive effect principle.Through finite element simulation and comparative experiments,the strain amplification performance of three substrate materials-silicone,Thermoplastic Elastomer(TPE),and Thermoplastic Polyurethane Elastomer(TPU)-was systematically analyzed,and silicone was selected as the optimal substrate material.The silicone substrate was bonded to the sensor housing,and the sensing layer was printed using Direct Ink Writing(DIW)technology,achieving structural integration of the substrate,housing,and sensing layer.A dedicated hardware and software system was developed for the sensor to enable signal acquisition,processing,and wafer status discrimination.Using a wafer cassette loaded with 25 pieces of 203.2 mm(8-inch)wafers as the test object,the sensor can accurately identify the presence status of wafers and exhibits excellent stability,providing a reliable solution for missing-wafer detection in wafer cassettes.