车规级陶瓷厚膜微电路芯片涂层视觉检测装备设计OA

To address the issues of high false-positive and false-negative rates in defect detection of automotive-grade ceramic thick-film microcircuit chips caused by small coating sizes,mutual overlap,and complex colors,a visual inspection equipment system is designed.First,considering the characteristics of multiple chip varieties,complex circuits,and high detection accuracy requirements,the equipment design scheme is determined.Then,the acquired chip coating images are processed through filtering and noise reduction,color space conversion,coating extraction,edge enhancement,and superimposed sharpening.Finally,the defect regions of the coating are extracted,and the Gamma correction method is applied to highlight the defect regions and darken the background regions.Engineering application results show that the equipment achieves a detection throughput of 12 chips/min,a false-negative rate of 0％,and a false-positive rate of no more than 3％,meeting the requirements for high-efficiency and high-precision inspection.