Cu/难熔金属体系不互溶纳米多层膜的研究现状与展望:从微观界面设计到宏观连接制造OA

As modern high-end manufacturing increasingly trends towards miniaturization and multifunctionality,achieving high-quality joining of dissimilar materials has encountered severe technical bottlenecks.Addressing this challenge,nano-multilayer films have emerged as a highly promising technological pathway for realizing low-temperature,highly reliable bonding,owing to their pronounced size effects and high-density interfacial structures.This review focuses on immiscible nano-multilayer films of the Cu/X(X=W,V,Mo,Ta,Nb)refractory metal systems,systematically elucidating the thermal stability evolution mechanisms governed by interfacial microstructures,as well as the intrinsic mechanisms that modulate mechanical properties and irradiation responses.Furthermore,it summarizes the recent research progress on their applications as high-performance brazing fillers or interlayers in brazing and diffusion bonding,highlighting their critical roles in mitigating residual stress in joints and suppressing the formation of brittle intermetallic compounds.Finally,it points out that future research should focus on the multi-scale computational modeling of spatial interfacial transport mechanisms and interfacial evolution mechanisms under multi-field coupling.Overcoming the high-temperature thermal stability bottleneck of this system is also identified as a key direction to advance its engineering applications.