Slurry injection schemes based on flow field distribution during chemical mechanical polishing processOA
Slurry injection schemes based on flow field distribution during chemical mechanical polishing process
Lifei Zhang;Nanhao Zhao;Hui Ci;Dewen Zhao;Xinchun Lu
Department of Mechanical Engineering,Tsinghua University,Beijing 100084,China||State Key Laboratory of Tribology in Advanced Equipment,Tsinghua University,Beijing 100084,ChinaHwatsing Technology Co.,Ltd.,Tianjin 300350,ChinaHwatsing Technology Co.,Ltd.,Tianjin 300350,ChinaDepartment of Mechanical Engineering,Tsinghua University,Beijing 100084,China||State Key Laboratory of Tribology in Advanced Equipment,Tsinghua University,Beijing 100084,ChinaDepartment of Mechanical Engineering,Tsinghua University,Beijing 100084,China||State Key Laboratory of Tribology in Advanced Equipment,Tsinghua University,Beijing 100084,China
chemical mechanical polishing(CMP)slurry injection positioncomputational fluid dynamics(CFD)flow field simulationmaterial removal rate(MRR)surface uniformity
chemical mechanical polishing(CMP)slurry injection positioncomputational fluid dynamics(CFD)flow field simulationmaterial removal rate(MRR)surface uniformity
《摩擦（英文）》 2026 (9)
67-76,10
The authors greatly appreciate the support of Hwatsing Technology Co.,Ltd.
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