晶圆表面球形污染物散射特性的角度依赖性研究OA
Angle-dependent Study of Light Scattering Properties of Wafer Surface Residues
针对集成电路制造中晶圆表面球形污染物检测的需求,基于光散射原理,研究了入射角和散射角对球形污染物散射特性的影响规律.采用Bobbert and Vlieger理论结合双向反射分布函数对晶圆表面球形污染物的散射场计算.在此基础上搭建了入射角和散射收集角可调的晶圆表面球形污染物检测系统,并采用粒径500 nm的聚苯乙烯乳胶(PSL)球形颗粒开展实验,考察了散射强度随入射角和散射收集角变化的依赖关系.鉴于探测器存在固定散射光接收范围,为避免散射信号淹没在反射信号中及因反射光直射导致探测器损坏,对实验角度范围进行适当限制.结果表明,散射收集角20 °下入射角从80 °至40 °信噪比增加了68.89%,入射角70 °下收集角从0 °至50 °时信噪比增加了102.25%,散射场分布主要集中在镜面反射角附近,此区域有更高的检测灵敏度;固定散射收集角和固定入射角下的仿真与实测值的均方根误差分别为0.073 1和0.094 2,理论模型能较好预测球形污染物的散射特性.
To investigate the influence of incident and scattering angles on spherical contaminant detection on wafer surfaces,a study based on light scattering principles was conducted.The scattering field was calculated using Bobbert and Vlieger theory with Bidirectional reflectance distribution function(BRDF).A detection system with adjustable angles was constructed to examine scattering intensity's angular dependence using 500 nm Polystyrene latex particles(PSL).Experimental angles were limited to prevent reflection interference and detector damage.With collection angle at 20 °,the signal-to-noise ratio increased by 68.89%as incident angle decreased from 80 ° to 40 °.With incident angle at 70 °,the signal-to-noise ratio increased by 102.25%as collection angle increased from 0 ° to 50 °.The scattered field concentrated near the specular reflection angle,exhibiting higher detection sensitivity in this region.Root-mean-square errors between simulation and measurement were 0.073 1(fixed scattering angle)and 0.094 2(fixed incident angle),validating the model's accuracy.
孙印壮;施玉书;张树;王芳;胡佳成
中国计量大学 计量测试与仪器学院,浙江 杭州 310018||中国计量科学研究院,北京 100029中国计量科学研究院,北京 100029||深圳中国计量科学研究院技术创新研究院,广东 深圳 518107中国计量科学研究院,北京 100029中国计量科学研究院,北京 100029中国计量大学 计量测试与仪器学院,浙江 杭州 310018
通用工业技术
散射测量无图案晶圆球形污染物入射角度晶圆表面污染检测
scattering measurementunpatterned waferspherical contaminantsangle of incidencewafer surface contamination detection
《计量学报》 2026 (7)
949-956,8
国家重点研发计划(2022YFF0605501)
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