首页|期刊导航|半导体学报(英文版)|Trends and advanced techniques in high-speed simultaneous bi-directional transceivers for die-to-die interfaces

Trends and advanced techniques in high-speed simultaneous bi-directional transceivers for die-to-die interfacesOA

Trends and advanced techniques in high-speed simultaneous bi-directional transceivers for die-to-die interfaces

Yufeng Ge;Ziqi Xue;Xuanyu Li;Aoxuan Wen;Hongzhi Wu;Pingyi Cai;Xuxu Cheng;Quan Pan

National Graduate College for Engineer,Southern University of Science and Technology,Shenzhen 518055,China||School of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,ChinaSchool of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,ChinaSchool of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,ChinaSchool of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,ChinaSchool of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,ChinaSchool of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,ChinaSchool of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,ChinaNational Graduate College for Engineer,Southern University of Science and Technology,Shenzhen 518055,China||School of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,China

《半导体学报(英文版)》 2026 (7)

18-23,6

The work is supported in part by the Science and Technology Plan of Shenzhen under Grant KJZD20240903100208012 and KJZD20231023100159002,in part by the SUSTech High-Level Special Funds under Grant G03034K007,and in part by the SUSTech-SANECHPS Research Grant HC-CNZXIC20260323001.

10.1088/1674-4926/26040030

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