5G基站主动天线单元阵列热管理系统设计与优化OA

To address the thermal dissipation demands of 5G base station active antenna unit arrays,a thermal management system for 5G microchip arrays based on thermal interface materials,microchannels and nanofluids,is designed in this study.A one-dimensional thermal resistance network model is established and integrated with a bi-objective optimization method,balancing thermal performance and economic cost.The operating characteristics of the system are analyzed,and a temperature uniformity optimization strategy is proposed for chips with high local heat flux density.The results show that,under the trade-off design,the weighted average junction temperature of the chips is 53.3℃,with an annualized total cost of 329.4 yuan.Compared with natural convection cooling,microchannel liquid cooling significantly improves the heat dissipation efficiency.The use of high thermal conductivity Al2O3-silicone oil composites reduces the weighted average junction temperature by 15.1%.The impact of different types of nanofluids on system performance is minimal.Under the uniform temperature optimization strategy,the average hotspot relative temperature difference is reduced by 3.2℃,and the weighted average junction temperature increases by only 0.8℃,effectively improving the temperature distribution uniformity.