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钼铜复合材料的研究进展与应用OA

Research progress and applications of Mo-Cu composite materials

中文摘要英文摘要

综述了钼铜复合材料的主要制备方法与研究进展,分析了各工艺的特点及其对材料微观组织结构和性能的影响,探讨了纳米粉体制备、放电等离子烧结等新兴技术在提升材料致密度与组织均匀性方面的应用成效.同时,介绍了钼铜复合材料在电子封装基板、热沉材料、电触头、药型罩以及航天国防等领域的应用现状.最后指出钼铜复合材料未来的发展方向应聚焦于高致密度与复杂结构件的高效成形技术,推动多种先进制备工艺的融合与优化,以实现材料性能的进一步突破与工程化应用的拓展.

This review summarizes the main fabrication methods and recent research progress of Mo-Cu composites,highlighting the characteristics of different processes and their influence on the microstructure and properties of the materials.Emerging technologies such as nanopowder synthesis and spark plasma sintering are evaluated for their effectiveness in enhancing densification and structural uniformity.The current applications of Mo-Cu composites in electronic packaging substrates,heat sink materials,electrical contacts,shaped charge liners,and aerospace and defense systems are also outlined.Finally,future research is suggested to focus on efficient forming techniques for high-density and complex-shaped components,as well as the integration and optimization of multiple advanced processing routes to achieve further improvements in material performance and broaden engineering applications.

何凯;石明君;安耿;刘仁智;梁靖;成会朝

金堆城钼业股份有限公司,陕西 西安 710077中南大学粉末冶金全国重点实验室,湖南 长沙 410083金堆城钼业股份有限公司,陕西 西安 710077金堆城钼业股份有限公司,陕西 西安 710077金堆城钼业股份有限公司,陕西 西安 710077中南大学粉末冶金全国重点实验室,湖南 长沙 410083

矿业与冶金

钼铜复合材料熔渗活化烧结超薄板材电子封装材料

Mo-Cu composite materialsinfiltrationactivated sinteringultra-thin sheetelectronic packaging materials

《中国钼业》 2026 (3)

1-10,10

国家重点研发计划(编号:2024YFB4608600)

10.13384/j.cnki.cmi.1006-2602.2026.03.001

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