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面向高密度互连电子器件的微结构模具数字化加工路径规划技术OA

Digital machining path planning technology for microstructured molds for high-density interconnect electronic devices

中文摘要英文摘要

随着科技的进步,数控技术得到长足发展的同时也伴随着新的挑战.高密度互连(HDI)电子器件正向微型化、三维化、异质集成发展,微结构模具的制造已成为制约其性能与可靠性的关键瓶颈.本文设计了一种结合深度学习(DL)和蚁群算法(ACO)的数控加工刀具路径规划模型.根据多轴数控机床与刀具的几何结构与工作原理,构建相应的数学模型.利用 DL 算法,从位置与姿态两个方面识别刀具状态,以当前刀具位姿为初始值,规划刀位轨迹;然后采用人工智能(AI)算法中的 ACO,利用多目标搜索快速在可行加工路径中选择确定最短路径.仿真实验显示,本文模型规划的路径在加工同类复杂微结构模具时,在保持高精度的同时,缩短了加工时间,且切削质量得到提高,刀具磨损得到有效抑制.

With the advancement of technology,while CNC technology has made significant progress,it has also been accompanied by new challenges.The development of high-density interconnect(HDI)electronic devices towards miniaturization,three dimensionalization,and heterogeneous integration has made the manufacturing of microstructure molds a key bottleneck that restricts their performance and reliability.This article proposes a CNC machining tool path planning model that combines deep learning(DL)and ant colony algorithm(ACO).Based on the geometric structure and working principle of multi axis CNC machine tools and cutting tools,construct corresponding mathematical models.Using DL algorithm,identify the tool status from both position and posture aspects,and plan the tool path based on the current tool pose as the initial value;Then,using ACO in artificial intelligence(AI)algorithms,multi-objective search is used to quickly select and determine the shortest path among feasible machining paths.Simulation experiments have shown that the path planned by the model in this article reduces machining time while maintaining high accuracy,significantly reduces cutting force fluctuations,and effectively suppresses tool wear when processing similar complex microstructure molds.

仇瑶

陕西机电职业技术学院,陕西 宝鸡 721001

矿业与冶金

高密度互连电子器件微结构模具数字化加工路径规划深度学习

High density interconnected electronic devicesMicrostructure moldDigital processingPath planningDeep learning

《模具技术》 2026 (2)

45-51,7

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