CSOP焊点形态对热疲劳寿命的影响与优化OA

The ceramic small outline package(CSOP)solder joint is taken as the research object,and the influence of solder wicking height and solder filling volume at the lead root in the soldering process on solder joint life is analyzed.Based on finite element simulation and combined with the Coffin-Manson life prediction model,the effect of different solder joint morphologies on solder joint reliability is analyzed.The results show that solder wicking significantly weakens the deformation buffering capacity of the lead bending structure:when the solder wicking height exceeds the first and second bends of the lead,respectively,the thermal fatigue life of the solder joint is reduced by 3.95％and 49.30％.As the solder filling volume at the lead root is increased from 0.025 21 mm3 to 0.041 08 mm3,stress concentration is effectively relieved by the formation of a full fillet,and the thermal fatigue life of the solder joint is thus increased by as much as 366.97％.A theoretical basis and optimization direction are provided for formulating process parameters related to solder joint morphology.