沉积气压调控氰酸酯表面Cu膜性能研究OA

Cyanate ester resin composites reinforced with quartz fibers(cyanate ester composites)exhibit high heat resistance,low water absorption,high strength,and superior dielectric properties,making them an ideal aerospace material.Surface metallization of cyanate ester composites can provide them with good electrical and magnetic conductivity without altering their excellent properties,better meeting functional applications in the aerospace field such as electromagnetic shielding of aircraft fuselages.Magnetic-filtered cathodic arc ion plating technology has the advantages of high ionization rate,high particle impact energy,strong adhesion strength,and precise controllability of film thickness,making it an effective method for the surface metallization of cyanate ester composites.Film deposition is a kinetic process where deposition pressure effectively modulates the kinetic impact of particles during the deposition.This alters the growth behavior of deposition,enabling precise control over the microstructure of Cu films,including grain size,crystallographic texture,and defects,thereby affecting their macroscopic properties.The work aims to adopt the magnetic-filtered cathodic arc ion plating technology to prepare Cu films on the surface of cyanate ester composites under deposition pressures of 0.10,0.30,0.50,0.70 and 0.90 Pa,in order to investigate the effect of deposition pressure on the structure and properties of the Cu films.Micromorphology and microstructure,including grain size,crystallographic texture,and chemical composition.were characterized through scanning electron microscope(SEM),atomic force microscope(AFM),X-ray Diffraction(XRD),and energy dispersive X-ray Spectroscopy(EDS).Furthermore,electrical resistivity and adhesion strength were evaluated via four-probe resistance measurements and tensile testing to analyze the correlation between structure and properties.To better analyze the interfacial bonding mechanism,SEM and X-ray photoelectron spectroscopy(XPS)were also used to examine the morphology and chemical bonds at the Cu film/cyanate ester composite interface.As the deposition pressure increased from 0.10 to 0.90 Pa,the grain size initially increased and then decreased,reaching a maximum of 67 nm at 0.50 Pa.while the smallest grain size of 11 nm was observed at 0.90 Pa,accompanied by numerous intergranular voids.Residual impurity gases inside the composite and vacuum chamber distributed along film defects,leading to lower purity.Additionally,at low pressures,the Cu film exhibited(200)texture.As deposition pressure increased to 0.90 Pa,the increase collision resulted in reduced particle energy and restricted diffusion,driving force for the growth of(111)oriented grains with the lowest surface free energy.The resistivity exhibited minimal variation at low deposition pressures,remaining around 1.7×10-8 Ω·m.When the pressure exceeded 0.50 Pa,resistivity increased significantly due to oxide formation,enhancing grain boundary scattering,and crystallographic texture transformations.At a deposition gas pressure of 0.90 Pa,the resistivity increased to 7.7×10-8 Ω·m.Chemical bonds at the Cu film/cyanate ester composite interface significantly affected bonding strength.Increased oxygen-containing bonds(such as C—O,C==O)and CuO formation at the interface enhanced adhesion strength.Optimal adhesion performance(approximately 3 MPa)was achieved at a deposition pressure of 0.50 Pa and 0.70 Pa.Deposition pressure significantly regulates the microstructure and properties of the Cu film.At a deposition pressure of 0.50 Pa,the film exhibits the optimal comprehensive performance.