首页|期刊导航|半导体学报(英文版)|Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chip
Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chipOA
Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chip
Ruifeng Li;Debo Wang
College of Integrated Circuit Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,ChinaCollege of Integrated Circuit Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,China
MEMSthermo-electromechanical couplingsensitivitymicrowave power detectioncantilever beam
MEMSthermo-electromechanical couplingsensitivitymicrowave power detectioncantilever beam
《半导体学报(英文版)》 2026 (6)
94-103,10
This work was supported by the National Natural Sci-ence Foundation of China(61904089),the Province Natural Sci-ence Foundation of Jiangsu(BK20190731).
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