首页|期刊导航|半导体学报(英文版)|Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chip

Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chipOA

Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chip

Ruifeng Li;Debo Wang

College of Integrated Circuit Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,ChinaCollege of Integrated Circuit Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,China

MEMSthermo-electromechanical couplingsensitivitymicrowave power detectioncantilever beam

MEMSthermo-electromechanical couplingsensitivitymicrowave power detectioncantilever beam

《半导体学报(英文版)》 2026 (6)

94-103,10

This work was supported by the National Natural Sci-ence Foundation of China(61904089),the Province Natural Sci-ence Foundation of Jiangsu(BK20190731).

10.1088/1674-4926/25120026

评论