基于中间相沥青黏结剂与石墨片填料快速制备炭/炭复合材料及其电磁屏蔽与导热性能OA
Rapidly fabricated carbon/carbon composites with a mesophase pitch binder and graphite flake filler with excellent EMI shielding and thermal conductivity
炭/炭(C/C)复合材料凭借其显著的低密度特性,在航空航天电磁屏蔽与热管理领域展现出巨大潜力.然而,传统 C/C 复合材料主要依赖反复致密化工艺来提升电磁屏蔽效能,这不仅会增加材料密度、与轻量化要求相悖,且制备周期冗长.本研究构建了一种以中间相沥青炭和石墨片为基体,中间相沥青基炭纤维为增强体的复合材料体系.通过一步加热成型过程中形成的高开气孔率与连续导电网络协同作用,实现了优异的综合性能:复合材料在 X 波段、电磁波由 XY 平面入射时,电磁屏蔽效能高达 83.97 dB;X方向热导率达 191.84 W·m-1·K-1,电导率达 6.50×104 S·m-1,弯曲强度超过 100 MPa,而体积密度仅为 1.01 g·cm-3.本研究提出的 C/C 复合材料短周期制备策略为制备兼具高电磁屏蔽效能、高效热管理与良好力学性能的低密度C/C复合材料.
Carbon/carbon(C/C)composites are ideal materials for electromagnetic inter-ference(EMI)shielding and thermal manage-ment in the aerospace field because of their low density.However,traditional C/C com-posites primarily rely on repeated densifica-tion to increase their EMI shielding effective-ness(SE),which not only increases density but also involves lengthy preparation cycles.We have constructed a unidirectional(1D)C/C composite using a matrix of mesophase pitch-derived carbon and graphite flakes,re-inforced with mesophase pitch-based carbon fibers.Using a one-step consolidation pro-cess produced by spontaneous assembly dur-ing heating,the open pores and a continuous conductive network give the composite an EMI SE of up to 83.97 dB in the 8.2-12.4 GHz(X-band).The material also has a thermal conductivity of 191.84 W·m-1·K-1 and an electrical conductivity of 6.50×104 S·m-1 along the fiber direction,together with a flexural strength exceeding 100 MPa,while having a bulk density of only 1.01 g·cm-3.This work therefore presents a short-cycle fabrication strategy for low-density C/C composites that integrate high EMI SE,efficient thermal management,and good mechanical properties.
罗鹏飞;田山;郭丰骏;肖志超
西安交通大学 金属材料强度全国重点实验室 材料科学与工程学院,陕西 西安,710049西安交通大学 金属材料强度全国重点实验室 材料科学与工程学院,陕西 西安,710049西安交通大学 金属材料强度全国重点实验室 材料科学与工程学院,陕西 西安,710049西安交通大学 金属材料强度全国重点实验室 材料科学与工程学院,陕西 西安,710049
通用工业技术
炭/炭(C/C)复合材料中间相沥青电磁屏蔽热导率电导率
Carbon/carbon(C/C)compositesMesophase pitchElectromagnetic interference(EMI)shieldingThermal conductivityElectrical conductivity
《新型炭材料(中英文)》 2026 (3)
597-611,15
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