用于先进复合材料成型的耐高温水溶性芯模的制备与性能研究OA
Preparation and Performance Study of High-temperature-resistant Water-soluble Core Molds for Advanced Composites Forming
采用聚乙烯吡咯烷酮(PVP)水溶液与海藻糖作为复合胶黏剂,以云母粉为基体材料,选用碳化硅和空心玻璃微珠作为改性填料,成功制备一种适用于复合材料成型的耐高温水溶性芯模材料.系统研究固化温度与胶黏剂配比对芯模材料力学性能及水溶性能的影响,对水溶性芯模微观形貌、成分、耐温性能以及热膨胀性能进行表征分析.结果表明:当固化温度达到160℃且胶黏剂中海藻糖质量分数为60%时,芯模材料呈现最佳综合性能,其弯曲强度与压缩强度分别达到17.34 MPa和12.43 MPa,水溶速率达到1.23 g/min.在420℃以下,该水溶性芯模材料表现出良好的热稳定性,其热膨胀系数在25~250℃温度区间内介于-3.10×10-5~1.02×10-5℃-1之间.
Polyvinylpyrrolidone(PVP)aqueous solution and trehalose were employed as composite adhesives,mica powder was selected as the matrix material,and silicon carbide and hollow glass microspheres were chosen as modifying fillers,whereby a high-temperature-resistant water-soluble core mold material suitable for composite molding was successfully prepared.The effects of curing temperature and adhesive formulation ratio on the mechanical and water-soluble properties of the core mold material were systematically investigated,and the micro-morphology,composition,thermal resistance,and thermal expansion behavior of the water-soluble core mold were characterized and analyzed.The results indicated that when the curing temperature reached 160℃and the mass fraction of trehalose in the adhesive was 60%,the core mold material exhibited optimal comprehensive performance,with its flexural strength and compressive strength reaching 17.34 MPa and 12.43 MPa,respectively,and the dissolution rate attaining 1.23 g/min.Below 420℃,this water-soluble core mold material demonstrated favorable thermal stability,and its coefficient of thermal expansion ranged between-3.10×10-5℃-1 and 1.02×10-5℃-1 within the temperature interval of 25~250℃.
李启志;寇旭;马克明;卢少微;王维枫;王柏臣;马承坤
沈阳航空航天大学材料科学与工程学院,辽宁 沈阳 110000沈阳航空航天大学材料科学与工程学院,辽宁 沈阳 110000沈阳航空航天大学材料科学与工程学院,辽宁 沈阳 110000沈阳航空航天大学材料科学与工程学院,辽宁 沈阳 110000沈阳航空航天大学材料科学与工程学院,辽宁 沈阳 110000沈阳航空航天大学材料科学与工程学院,辽宁 沈阳 110000沈阳航空航天大学材料科学与工程学院,辽宁 沈阳 110000
通用工业技术
耐高温水溶芯海藻糖/PVP胶黏剂复合材料
High-temperature-resistancyWater-soluble coreTrehalose/PVP adhesiveComposites
《塑料科技》 2026 (6)
127-132,6
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