基于ARM和FPGA设计的电机控制SiP电路OA
Design of motor control SiP circuit based on ARM and FPGA
传统电机控制电路一般采用分立元件,按照特定互联关系和约束规则布局于PCB板,存在尺寸较大且可靠性不高的问题,无法满足电机控制系统小型化、轻量化的需求.系统级封装(SiP)是利用先进工艺,在单一封装基板上组装和集成多个IC芯片及不同类型的元器件,可构成具有特定功能的电子信息系统.基于系统级封装技术,设计一种电机控制SiP电路.该SiP集成ARM裸芯和FPGA裸芯,两颗芯片通过Wire-bond工艺连接于PBGA321基板上,形成SiP电路.相比ARM和FPGA分立设计的电机控制系统,该电机控制SiP体积缩小50%以上,质量减轻60%以上,有效解决了传统PCB板级电机控制电路存在的大尺寸问题,达到了小型化和高可靠性的目的.测试结果表明,该电路满足设计要求,在电机控制领域具有一定的应用场景.
Traditional motor control circuits generally adopt discrete components.These discrete circuits are laid out on PCBs according to predefined connection rules,yet they suffer from bulky volume and low reliability,failing to satisfy the miniaturization and lightweight development needs of motor control systems.System-in-package(SiP)can use advanced processes to assemble and integrate multiple IC chips and various types of components on a single packaging substrate,forming an electronic information system with specific functionalities.A SiP circuit of motor control is designed based on SiP technology.The SiP circuit includes an advanced RISC machine(ARM)bare die and a field programmable gate array(FPGA)bare die,which are connected by Wire-bond technology and stacked in a PBGA321 substrate to form the SiP circuit.In comparison with motor control system designed with separate ARM and FPGA architectures,the SiP volume is reduced by more than 50%and the quality is reduced by more than 60%,which effectively solves the large-size problem existing in traditional PCB board-level motor control circuits,and achieving the goals of miniaturization and high reliability.The testing results show that this circuit can meet the design requirements and has a certain application prospect in the field of motor control.
武明月;杜存玉;陈涛;艾亚辉
中国电子科技集团公司第五十八研究所,江苏 无锡 214026中国电子科技集团公司第五十八研究所,江苏 无锡 214026中国电子科技集团公司第五十八研究所,江苏 无锡 214026中国电子科技集团公司第五十八研究所,江苏 无锡 214026
信息技术与安全科学
Wire-bond系统级封装ARMFPGA电机控制PBGA小型化
Wird-bondsystem-in-packageARMFPGAmotor controlplastic ball grid arraminiaturization
《现代电子技术》 2026 (12)
37-42,6
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