基于UWB技术的晶圆传输机器人定位优化算法OA

Traditional laser positioning technology for mobile platforms is not only expensive,but also prone to being obstructed by obstacles and unable to recognize during operation.In addition,the positioning accuracy is also affected by changes in ambient light.In allusion to the positioning problem of wafer handling,a wafer handling platform positioning system based on ultra-wideband(UWB)technology is designed by means of the time-of-flight(TOF)ranging principle,which addresses the issues that traditional laser positioning is susceptible to occlusion and ambient light interference.In allusion to the problems that the single-sided two-way ranging(SS-TWR)algorithm is affected by the frequency deviation of the microcontroller unit(MCU),the improved double-sided two-way ranging(DS-TWR)algorithm combined with the three-sided positioning method is used to eliminate the cumulative error caused by frequency deviation.The experimental simulation platform is built,the motion trajectories of two UWB positioning technologies:SS-TWR and DS-TWR are compared and tested,and the error analysis and data comparison are conducted with traditional laser positioning technology.The experimental results show that the proposed solution can enable the wafer handing platform to realize the positioning accuracy close to that of laser positioning while controlling hardware costs.