脉冲微泡强化黄铜矿浸出机制研究OA

In order to improve the leaching efficiency of chalcopyrite,on the basis of the conventional heating leaching system,the pulse microbubble method is introduced to reduce the influence of the sulfide layer by improving the mass transfer efficiency in the leaching process.The kinetics is discussed,the morphology of the leaching residue is analyzed,and the mechanism of pulse microbubble-enhanced leaching is revealed.The results show that the pulsed microbubbles can significantly improve the leaching rate of chalcopyrite,and the increase rate rises with the decrease in microbubble size.Under the optimum conditions of conventional leaching,the copper leaching rate is only 53.6％,while under the same conditions,the copper leaching rate can increase to 62.48％and 80.40％when the pore size of the orifice plate is 94 and 75 μm,respectively.The SEM test results show that the pulsed microbubbles can effectively improve the aggregation degree and coverage area of the sulfide layer on the surface of chalcopyrite.The mechanism may be that the pulsed microbubbles have higher mass transfer efficiency and can accelerate the reaction rate.At the same time,the local high temperature and high pressure released during the burst can weaken the passivation of the sulfide layer during the leaching process,thereby improving the leaching effect of chalcopyrite.