F波段低损耗宽带波导气密结构OA

With the advancement of millimeter-wave communication and radar technologies,high-frequency electronic systems impose stringent requirements on hermetic packaging for components.However,traditional hermetic transition structures often struggle to simultaneously achieve low insertion loss and wide bandwidth performance.To address this challenge,this paper presents the design and verification of a high-performance hermetic circuit structure based on an H-plane microstrip-to-waveguide probe.The structure employs a quartz substrate that fully covers the waveguide aperture for solder sealing,and utilizes a centrally symmetric microstrip topology circuit to achieve efficient waveguide-to-microstrip transition.Simulation results demonstrate that within the 101～122 GHz frequency band,the structure achieves an Insertion Loss(IL)of less than 0.183 dB and a Return Loss(RL)greater than 20 dB.Measured results show that within the 105～121 GHz bandwidth,the IL remains below 1.02 dB with a RL better than 20 dB,the helium leak rate is below 6.6×10-10 Pa ∙ m3/s.These results confirm that the proposed design not only delivers excellent airtightness and low-loss characteristics,but also offers advantages including compact structure,flexible port length configuration,and simple fabrication process,making it highly suitable for practical engineering applications.