射频异构微系统集成技术综述OA

With the continuous advancement of semiconductor and packaging processes,radio frequency(RF)microsystems are evolving toward high integration,low cost,and high performance,making their integration technologies a hot topic of research in both academia and industry.The development of integration technologies such as wire bonding,flip chip,2.5D,and 3D provides strong support for enhancing the performance and functional density of RF microsystems.Based on fundamental integration technologies for RF microsystems,the latest research progress in various hybrid heterogeneous integration technologies is systematically reviewed,comparative analysis and discussion of these technologies are conducted,and a summary and outlook are provided.