有机基板积层绝缘膜的关键性能权衡与技术展望OA

Build-up dielectric films are recognized as critical materials in advanced packaging,whose performance directly determines the reliability and signal transmission rate of chip systems.However,simultaneously optimizing four key properties(high copper adhesion,a low coefficient of thermal expansion,low dielectric properties,and excellent processability)poses the formidable"performance quadrilateral"dilemma due to fundamental conflicts in the underlying physical and chemical mechanisms.Mainstream strategies and research progress regarding traditional build-up dielectric films in the fields of low-dielectric resin design,filler-resin interface regulation,and high-filling composite fabrication processes are summarized.Based on this foundation,key issues hindering synergistic performance enhancement are further analyzed from molecular and mesoscopic levels.To overcome the limitations of traditional trial-and-error methods,the potential of AI to provide a disruptive and transformative approach to resolve these complex performance trade-off challenges through a multi-scale co-design framework is elucidated.The key hurdles that must be addressed for the successful implementation of AI in this field are also identified.An outlook on future trends and technological directions for advanced build-up dielectric film materials is provided.