硅基射频微系统的传热及热-力耦合仿真研究OA

As the core components of information transmission and reception,RF microsystems play an important role in the precise transmission of information.With the trend of electronic devices towards miniaturization,high-density integration and high power density,RF microsystems have become mainstream products with their advantages of high performance,high reliability and low cost.Due to the small size and high power density of RF microsystems,the heat dissipation problem during operation becomes more and more prominent,which seriously affects their reliability.Therefore,finite element simulation can be used to predict the reliability of such systems under opercrtion to optimize the design.Taking an RF microsystem developed via 3D heterogeneous integration as an example,its heat transfer and thermo-mechanical coupling characteristics are analyzed using finite element simulation,and its thermal and mechanical performance under operation is predicted.This approach effectively avoids design risks and provides support for the high-reliability design of such systems.