面向无人平台的高速实时成像处理微系统OA

To address the demand for miniaturized,and low-power Synthetic Aperture Radar(SAR)systems on unmanned platforms,this study developed a high-speed imaging micro-system leveraging heterogeneous System-in-Package(SiP)technology.The system in-tegrates an FPGA,a DSP,multiple DDR3 memory chips,and a LDO.Comprehensive electrical,thermal,and mechanical simulations validated the system's signal integrity,thermal management,and structural robustness.Electrical simulations confirmed that the key signals of DDR3-1600MT/s and 5 GT/s SerDes meet design requirements in terms of insertion loss,return loss,and crosstalk.Thermal simulations verified that the junction temperature of the chips remains controllable with the application of a cold plate.Mechanical analy-sis demonstrated that the stress under thermal cycling and vibration shock conditions remains below the material limits.Imaging experi-ments showed close agreement between point-target responses,real-world data,and MATLAB simulations,with key metrics such as the Peak Side Lobe Ratio(PSLR)meeting performance targets.These results demonstrate the micro-system's viability for enabling lightweight,high-performance SAR processing on unmanned platforms.