FC-CCGA封装可靠性分析与寿命预测OA

As electronic packaging technology advances towards high-density and highly integrated configurations,FC-CCGA packages are increasingly adopted in aerospace and other high-reliability applications due to their superior electrical and thermal performance and I/O density.These packages must withstand vibrational loads during launch and thermal cycling during in-orbit operation,with their core interconnect components susceptible to stress accumulation leading to thermomechanical fatigue failure,directly threatening the re-liability and lifespan of the package devices.This study,based on the Anand model,constructs a comprehensive electro-mechanical 3D model encompassing chip bumps,solder columns,epoxy resin,and PCB substrate,systematically investigating the vibration and ther-mal fatigue reliability of FC-CCGA solder joints and bumps.The analysis includes impact response spectrum assessments pre-electrical and post-electrical reinforcement,simulating the stress-strain response of critical solder joints and bumps under thermal cycling loads,and evaluating the plastic strain distribution and evolution over time.Additionally,the Coffin-Manson model is employed to predict the thermo-mechanical fatigue life of the solder joints and bumps.Temperature cycling tests on packaged devices were conducted,observing morphological changes in solder joints at varying cycle counts.The experimental results align with simulation predictions,providing a theoretical basis and methodological support for optimizing solder joint structures and assessing their lifespan for high-reliability applications.