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半导体用主流金属前驱体的现况及发展OA

Current status and development of mainstream metal precursors for semiconductors

中文摘要英文摘要

根据在集成电路制造中的不同应用,半导体用金属前驱体主要分为两大类,即用于高介电常数薄膜的高k前驱体和用于金属层薄膜的金属层前驱体.当互补金属氧化物半导体(Complementary Metal-Oxide-Semiconductor,CMOS)器件的特征尺寸缩小至45 nm以下时,二氧化硅(SiO2)作为栅介质材料已经无法满足器件性能和功耗的需要,用金属高k材料替代SiO2是必然选择.目前,在逻辑电路中主要使用氧化铪(HfO2)和SiO2叠层,匹配偶极层氧化镧(LaOx);动态随机存取存储器(Dynamic Random-Access Memory,DRAM)存储芯片使用的是由过去的氧化锆/铝/氧化锆(ZrO2/Al/ZrO2)叠层结构转化为以ZrxHfyO为主体并搭配其他金属高k叠层或掺杂的多元结构.然而,高k介质材料的固有权衡关系是高的介电常数会伴随小的带隙,因此需要通过掺杂,形成三元及以上的多元体系,利用单一材料的高k值或者高带隙特性形成性能互补.此外,随着技术节点的缩小,先进金属层的重要性日益凸显.例如,氮化钽(TaN)凭借其优异的扩散阻挡能力和热稳定性,用于后道互连阻挡层.钼(Mo)凭借其低电阻率和良好的尺寸微缩能力,成为NAND存储芯片中极具潜力的金属层材料.为了满足先进制程需求,金属层前驱体必须具备高纯度、高挥发性、高稳定性、高反应性的特点,且与相邻材料具备良好的界面兼容性.基于过去的研究成果,总结了现有工艺路线常用的高k和金属前驱体及相关的品质和包装钢瓶特点,并依照现有的最新研究和产业路线,对将来半导体用高k和金属前驱体的发展方向做出一定的预判,希望对现有的产业提供一定的引导,最终为开发可产业化的新型金属高k前驱体材料提供参考.

Based on their different applications in integrated circuit manufacturing,semiconductor metal precursors are primarily divided into two categories:high-k precursors for high-k thin films and metal layer precursors for metal layer thin films.As Complementary Metal-Oxide-Semiconductor(CMOS)device feature sizes shrink below 45 nm,SiO2 can no longer meet the performance and power consumption requirements as a gate dielectric material,making the replacement of SiO2 with metal high-k materials an inevitable choice.Currently,HfO2/SiO2 stacks paired with a dipole layer LaOx are predominantly used in logic circuits,while DRAM memory chips have transitioned from the previous ZrO2/Al/ZrO2 stack structure to a multicomponent system based on ZrxHfyO,combined with other metal high-k stacks or dopants.However,an inherent trade-off of high-k dielectric materials is that a high dielectric constant is accompanied by a small band gap.Therefore,doping is necessary to form ternary or more complex multicomponent systems,leveraging the high-k value or high band gap characteristics of individual materials to achieve complementary performance.Additionally,as technology nodes shrink,the importance of advanced metal layers is increasingly prominent.For example,TaN is used as a barrier layer in back-end-of-line interconnects due to its excellent diffusion barrier properties and thermal stability.Mo,with its low resistivity and good scalability,has become a promising metal layer material in NAND memory chips.To meet the demands of advanced processes,metal layer precursors must possess high purity,high volatility,high stability,high reactivity,and good interfacial compatibility with adjacent materials.Based on past research achievements,this paper will summarize the high-k and metal precursors commonly used in existing process routes,along with related quality and packaging cylinder requirements.Furthermore,following the latest research and industrial roadmaps,it will provide some predictions regarding the future development directions of high-k and metal precursors for semiconductors,aiming to offer guidance for the existing industry and ultimately facilitate the development of novel metal high-k precursor materials suitable for industrialization.

王孝进;胡昌明;乔玮;王博文;罗文娇;鞠熀先;黎书华;顾金楼;杨敏

华东理工大学,上海,200237江苏南大光电材料股份有限公司,苏州,215000||南京大学化学学院,南京,210023江苏南大光电材料股份有限公司,苏州,215000||南京大学化学学院,南京,210023江苏南大光电材料股份有限公司,苏州,215000江苏南大光电材料股份有限公司,苏州,215000南京大学化学学院,南京,210023南京大学化学学院,南京,210023华东理工大学,上海,200237江苏南大光电材料股份有限公司,苏州,215000

数理科学

半导体材料先进制程高k金属前驱体产业化

semiconductor materialsadvanced processeshigh-k gatemetal precursorsproduction

《南京大学学报(自然科学版)》 2026 (3)

485-504,20

江苏省基础研究计划重点项目(BK20243027)

10.13232/j.cnki.jnju.2026.03.014

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