环氧树脂基复合材料的灌封防护性能OA
Encapsulation Protective Properties of Epoxy Resin Matrix Composites
针对嵌入式测试仪器中灌封材料的高g值冲击防护问题,制备了不同含量端羧基液体丁腈橡胶(Carboxylated-Terminated Liquid Acrylonitrile Rubber,CTBN)的树脂基复合材料作为测试仪器的灌封材料.通过单轴压缩试验研究CTBN含量对材料力学性能的影响,采用标准的朱-王-唐(Zhu-Wang-Tang,ZWT)非线性粘弹性模型描述灌封材料.将数值模拟得到的弹体侵彻过载分解重构作为仪器加载信号,分析了灌封材料中CTBN含量、加载条件和内部结构对仪器内部元器件高g值冲击的影响.结果表明,将芯片安装在远离中心的位置和使用强度较高的灌封材料都可以有效降低芯片上的应力幅值.通过改变芯片的安装位置,可以降低大多数细节信号的能量,调整灌封材料中CTBN的含量可以降低特定频段内细节信号的能量.
Aiming at the problem of high-g impact protection of encapsulating materials in embedded mea-surement instruments,resin-based composites with different contents of Carboxylated-terminated liquid acrylonitrile rubber(CTBN)were prepared as encapsulating materials for measurement instruments.The effect of CTBN content on the mechanical properties of the material was studied by a uniaxial compression test.The standard Zhu-wang-tang(ZWT)nonlinear viscoelastic model was used to describe the encapsu-lating material.The penetration overload of the projectile obtained by numerical simulation is decomposed and reconstructed as the loading signal of the instrument.The influence of CTBN content,loading condi-tions and internal structure on the high-g impact of the internal components of the instrument is analyzed.The results show that the stress amplitude on the chip can be effectively reduced by installing the chip away from the center and using high-strength encapsulating materials.By changing the installation position of the chip,the energy of most detail signals can be reduced,and adjusting the content of CTBN in the encapsulating material can reduce the energy of detail signals in a specific frequency band.
郭宇健;范志强;崔勇鑫
中北大学 航空宇航学院,山西 太原 030051中北大学 航空宇航学院,山西 太原 030051||中北大学 电子测试技术重点实验室,山西 太原 030051中北大学 航空宇航学院,山西 太原 030051
通用工业技术
嵌入式测试仪器灌封防护小波分析树脂基复合材料ZWT非线性粘弹性模型
embedded measurement instrumentsencapsulating protectionsignal analysisresin matrix compositesZWT nonlinear viscoelastic model
《测试技术学报》 2026 (3)
289-298,10
国家自然科学基金资助项目(U2341236)山西省基础研究计划资助项目(202403021211157)电子测试技术重点实验室开放基金资助项目(2024-DZCSJS-04)
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