环氧树脂咪唑类潜伏性固化剂的制备与性能研究OA
Preparation and performance study of latent imidazole curing agents for epoxy resin
通过咪唑(MI)与巴比妥酸(BA)在水溶液中的酸碱中和反应,制备了咪唑巴比妥酸盐(BAM),并将其用作环氧树脂(EP)体系的潜伏性固化剂.本研究借助傅里叶变换红外光谱与核磁共振氢谱,对BAM的分子结构进行了系统表征,采用差示扫描量热分析、流变测试、动态热机械分析和力学性能测试系统评估了EP/BAM体系的潜伏性、储存稳定性及机械性能.研究结果显示,巴比妥酸的引入显著降低了咪唑的固化活性,与EP/MI体系相比,EP/BAM体系的固化放热峰向高温区移动约60℃,室温储存期延长至 63 d,并在中温条件下实现快速固化,兼具优异的潜伏性和高效固化性能.此外,EP/BAM固化物的玻璃化转变温度维持在163.9℃,与EP/MI固化体系相比,其强度和模量均更优,展现出更优异的耐热性和机械性能.综上所述,EP/BAM体系为单组分环氧树脂体系开发提供了一种高效的新策略.
Imidazole barbiturate(BAM)was synthesized through an acid-base neutralization reaction between imidazole(MI)and barbituric acid(BA)in an aqueous solution and employed as a latent curing agent for epoxy res-in(EP)systems.This study systematically characterized the molecular structure of BAM using Fourier-transform in-frared spectroscopy and proton nuclear magnetic resonance spectroscopy.The latent curing behavior,storage stability,and mechanical performance of the EP/BAM system were evaluated using differential scanning calorimetry,rheological analysis,dynamic mechanical analysis,and mechanical property testing.The results showed that the introduction of barbituric acid significantly reduced the curing activity of imidazole,shifting the curing exothermic peak of the EP/BAM system approximately 60℃higher compared to the EP/MI system.The EP/BAM system exhibited excellent stor-age stability with a room-temperature storage period of up to 63 days,while achieving rapid curing under moderate-temperature conditions.Additionally,the cured EP/BAM system maintained a glass transition temperature of 163.9℃and showed higher strength and modulus compared to the EP/MI system,demonstrating superior thermal resistance and mechanical performance.In conclusion,the EP/BAM system exhibits remarkable advantages in latency,storage stability,and post-curing performance,providing a novel and efficient strategy for the development of one-component epoxy resin systems.
刘伟
百思通新材料科技(武汉)有限公司,武汉 430100
通用工业技术
单组分环氧树脂潜伏性固化剂咪唑耐热性力学性能
one-component epoxy resinlatent curing agentimidazolethermal resistancemechanical performance
《复合材料科学与工程》 2026 (4)
72-77,6
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