光电融合集成与通信感知技术OA

Driven by the rapid advancement of broadband communications,artificial intelligence,and satellite internet,global data traffic is growing exponentially,while conventional electronic integration is approaching physical limits in bandwidth,power consumption,and latency.Photonics-electronics multiplex integration,leveraging multi-dimensional synergy across the full hierarchy from materials and devices to chips and systems,transcends the bandwidth and power constraints of all-electronic architectures and is emerging as a key enabling technology for next-generation information systems.A systematic review of recent advances in photonics-electronics multiplex integration was presented.Its conceptual framework and developmental trends were first delineated,followed by a survey of high-fidelity simulation technologies that bridge link-level systems and chip-scale implementations,with particular emphasis on the state of the art in heterogeneous integration processes,core devices,and system-on-chip architectures.Representative applications in high-speed communications and intelligent sensing were subsequently examined,followed by a forward-looking discussion of future trajectories toward space,air,and ground integrated networks and AI computing clusters.Three grand challenges that must be addressed were further identified,namely the limits of multi-physics coupling,cross-scale manufacturing consistency,and intelligent adaptive control,and a phased breakthrough roadmap was proposed.These offer strategic insights for ubiquitous 6G coverage and the sustainable evolution of computing networks.