A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing:Shear slippingOA
A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing:Shear slipping
Yushan Chen;Liuyue Xu;Yuan Wu;Liao Zhou;Yuting Wei;Zihan Zheng;Hui Li;Liang Jiang;Linmao Qian
Tribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,ChinaTribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,ChinaTribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,ChinaTribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,ChinaTribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,ChinaTribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,ChinaTribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,ChinaTribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,ChinaTribology Research Institute,State Key Laboratory of Rail Transit Vehicle System,Southwest Jiaotong University,Chengdu 610031,China
chemical mechanical polishing(CMP)layered materialbismuthmaterial removal modeshear slipping
chemical mechanical polishing(CMP)layered materialbismuthmaterial removal modeshear slipping
《摩擦（英文）》 2026 (4)
19-29,11
The authors are grateful for the financial support from the National Natural Science Foundation of China(Nos.51991373 and 52235004),the National Key R&D Program of China(No.2020YFA0711001),and the Fundamental Research Funds for the Central Universities(Nos.2682025CG001 and 2682024CG007).
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