半导体晶圆键合力控制技术的研究进展与挑战OA
Research Progress and Challenges of the Force Control Technology in Semiconductor Wafer Bonding
综述了半导体晶圆键合力控制技术的研究现状与发展趋势.介绍了晶圆键合的基本原理和分类,分析了键合力在晶圆键合过程中的关键作用.详细阐述了影响键合力的主要因素,包括表面形貌、清洁度、化学处理、温度与压力参数等.重点探讨了直接键合、阳极键合、黏合剂键合等典型键合技术的力学控制方法,并介绍了界面表征与键合力测量的关键技术.进一步分析了晶圆键合力控制面临的挑战,提出了未来的发展方向,为半导体制造领域的键合工艺优化提供参考.
The research status and development trend of the force control technology in semiconductor wafer bonding are reviewed.The basic principles and classification of wafer bonding are introduced,and the key role of bonding force in the wafer bonding process is analyzed.The main factors influencing the bonding force are elaborated in detail,including the parameters of surface morphology,cleanliness,chemical treatment,temperature,and pressure.The mechanical control methods for typical bonding techniques are mainly discussed,such as direct bonding,anodic bonding,and adhesive bonding.The key technologies of interface characterization and bonding force measurement are also presented.The force control challenges of wafer bonding are further analyzed,and the development directions are proposed,thereby providing a reference for the optimization of bonding processes in the semiconductor manufacturing field.
张慧;郑志伟;张辉;王成君
南京林业大学机械电子工程学院,南京 210037南京汇智工业设计有限公司,南京 211153东南大学机械工程学院,南京 211189东南大学机械工程学院,南京 211189||中国电子科技集团公司第二研究所,太原 030024
信息技术与安全科学
半导体制造晶圆键合键合力控制工艺优化
semiconductor manufacturingwafer bondingbonding force controlprocess optimization
《电子与封装》 2026 (4)
21-27,7
国家重点研发计划(2022YFB3404300)国家自然科学基金青年科学基金项目(52405304)智能机器人湖北省重点实验室项目(HBIR202303)
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