一种基于HTCC工艺的T/R组件用一体化CBGA外壳OA
Integrated CBGA Housing for T/R Components Based on the HTCC Process
基于高温共烧陶瓷(HTCC)工艺,设计了一款应用于8～12 GHz内发射/接收(T/R)组件封装用的一体化陶瓷球栅阵列(CBGA)外壳,以实现组件封装的小型化、高集成、低成本要求.微波端口设计方面,根据共面波导和同轴线理论,利用HFSS软件对微波传输结构进行仿真优化,实物端口测试结果显示,在8～12 GHz内,|S21|＜0.2 dB、|S11|＞20 dB.结构设计方面,利用ABAQUS软件优化外壳结构、改进尺寸设计,外壳经过高温钎焊后底部植球面平面度≤60μm,焊球拉脱力、剪切力均≥3.5N,满足后续板级工况应用需求.
Based on the high-temperature co-fired ceramic(HTCC)process,an integrated ceramic ball grid array(CBGA)housing applied to transmitter/receiver(T/R)component packaging within 8-12 GHz is designed to achieve the miniaturization,high-integration,and low-cost requirements of component packaging.In terms of microwave port design,according to the theory of coplanar waveguide and coaxial line,HFSS software is used to simulate and optimize the microwave transmission structure,and the physical port test results show that,within the 8-12 GHz frequency range,|S21|＜0.2 dB and|S11|＞20 dB.In terms of structural design,the housing structure is optimized by using ABAQUS software to improve the dimensional design.After high-temperature brazing,flatness of the bottom spherical surface is ≤ 60 μm,the pull-off and shear strength of the solder balls are both ≥3.5 N,meeting the requirements for subsequent board-level applications.
邵金涛;颜汇锃;戴雷;谢新根
南京电子器件研究所,南京 210016南京电子器件研究所,南京 210016南京电子器件研究所,南京 210016南京电子器件研究所,南京 210016
信息技术与安全科学
HTCCCBGA外壳微波端口设计结构设计
HTCCCBGA housingmicrowave port designstructural design
《电子与封装》 2026 (4)
1-6,6
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