基于LTCC的内嵌金属柱微流道结构设计研究OA

With the rapid development of electronic devices toward high power density and miniaturization,efficient chip heat dissipation has emerged as a critical technical bottleneck limiting their performance and reliability.Microchannel cooling technology has garnered significant attention due to its superior heat dissipation capability.In this study,a microchannel structure with embedded metal pillars based on low-temperature co-fired ceramic(LTCC)was proposed.The effects of the spatial arrangement,cross-sectional shape,and size of the metal pillars,as well as the inlet flow velocity,on the heat dissipation performance and pressure drop of microchannel structures were systematically investigated via multiphysics simulations.The results demonstrated that introducing the circular metal pillar arrays and increasing the inlet flow velocity can significantly enhance the heat dissipation efficiency.The optimal cooling effect can be achieved when the metal pillar diameter accounts for 40％ of the channel width,which reduced the chip temperature by more than 6.4％compared with the microchannel structure without embedded metal pillars.Notably,the proposed gradient non-uniform pillar arrangement strategy not only effectively improves pressure drop characteristics but also further reduces the maximum chip temperature by 1.1％ compared with the traditional uniform arrangement.This work provides a novel solution for addressing the inherent trade-off between heat dissipation and pressure drop in microchannels.