激光刻蚀-等离子活化对PI/Cu界面结合强度增强机理研究OA

To address the strong chemical inertness of rigid polyimide(PI)and its low adhesion strength with copper(Cu)layers,a synergistic modification method combining laser etching and plasma activation was proposed to enhance the interfacial adhesion strength and consistency of PI/Cu.Laser etching parameters,including scan spacing,scanning speed,pulse repetition frequency,and laser power,were optimized using an orthogonal experimental design,followed by O2/N2 plasma activation for sample preparation and systematic characterization.The results show that under laser etching conditions of a scan spacing of 10 μm,a scanning speed of 100 mm/s,a repetition frequency of 50 kHz,and a power of 3 W,combined with 60 min plasma activation,the PI/Cu interfacial adhesion strength reaches the optimum,with an average value of 31.62 MPa and a standard deviation of 6.47 MPa.Mechanism analysis indicates that laser etching constructs regular groove structures to increase the effective interfacial area,while plasma activation removes residues,introduces active functional groups,and reconstructs nanoscale surface features.The synergistic effect of the two processes establishes a dual enhancement mechanism of mechanical interlocking and chemical bonding,resulting in an adhesion strength far exceeding the requirement of the GJB 362C standard.This study provides a feasible approach for the surface metallization of rigid PI.