高热稳定性石墨烯包覆细晶铜复合材料的研制OA

The poor thermal stability of metallic copper limits its applications.This study fabricated graphene-encapsulated fine-grained copper composites via chemical vapor deposition(CVD)and investigated graphene growth on fine-grained copper(about 1 μm diameter).Results showed that pure copper's grain size increased from 2.03 μm(600℃)to 18.2 μm(1000℃),with hardness decreasing from 91.56HV to 27.64HV.Interestingly,graphene-encapsulated composites maintained stable grain size distribution(1.25～1.35 μm)and hardness distribution(83.96～100.63HV)across the different temperatures.These findings demonstrated that the graphene encapsulation on fine-grained copper significantly enhanced thermal stability by inhibiting copper atom diffusion.Furthermore,the drawn composite wires fabricated from the graphene-encapsulated copper composites by annealing at 1000℃showed a 53.9%increase in hardness,a 12%improvement in tensile strength,a 29.8%higher elongation,and a 6.8%reduction in electrical resistivity compared with the counterpart produced from pure copper.This work provided new insights for fabricating copper-based composites with superior thermal stability.