无人机边缘高性能计算终端热设计OA

This study investigates the thermal design challenges associated with high heat flux in an edge high-performance computing terminal intended for airborne deployment on unmanned aerial vehicle(UAV).Addressing the stringent constraints on size,weight,power consumption,and cost inherent to UAV platforms,coupled with the challenge of concentrated hotspots generated by high-performance chips,this study analyzes the power consumption dissipation characteristics of typical hardware architec-tures for such terminals and evaluates the adaptability of different cooling methods.A lightweight,low-cost thermal design solution combining air-through cooling with heat pipe for uniform temperature is pro-posed.By optimizing the airflow channel layout and implementing module-level temperature uniformity design,the junction temperature of high-performance computing module chips is maintained within per-missible limits under the condition of 992 TOPS@INT8 total computing power in high-temperature envi-ronment.The results show that this proposed thermal design not only effectively ensures thermal dissipa-tion performance but also significantly reduces system complexity and cost,thereby offering a viable ther-mal management approach for the development of high-performance edge computing terminal for UAV applications.