微米铜粉的制备及其在柔性电子领域的应用OA

Micron copper powder is a metallic material characterized by excellent electrical and thermal conductivity,good processability and chemical stability.Owing to its diverse morphological features,it can be formulated into conductive pastes and transferred onto flexible substrates via screen printing,inkjet printing and other techniques to fabricate flexible conductive circuits.These properties make it highly suitable for applications in flexible displays,wearable sensors and flexible solar cells.This review summarized the preparation methods and characteristics of micron-sized copper powder,presenting recent research progress and application developments both domestically and internationally.It focused on its utilization in wearable electronics,flexible sensors and electromagnetic shielding films within the field of flexible electronics.Furthermore,the challenges related to morphology control,growth mechanisms and oxidation resistance were critically analyzed.Finally,the review outlined future research directions,emphasizing the need for environmentally friendly strategies to produce micron copper powders with high sphericity,good dispersibility and narrow particle size distribution.In light of the growing demand for flexible electronics,expanding the application landscape of micron-sized copper powder was also expected to become a significant focus in future studies.