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增材制造碳化硅微观结构的离子辐照行为OA

Ion Irradiation Behavior of Additively Manufactured Silicon Carbide Mi-crostructure

中文摘要英文摘要

粘合剂喷射成形(BJ)结合化学气相渗透(CVI)的增材制造技术能够制备高纯度、大尺寸、复杂形状的碳化硅,是解决核用碳化硅材料制备问题的重要候选技术路线.但该工艺制备的碳化硅特别是CVI沉积碳化硅在辐照条件下的稳定性仍缺乏研究,制约了其作为核级材料的进一步发展.本研究采用平均粒径为20 μm的高纯度碳化硅粉末,通过BJ+CVI工艺制备了直径20 mm、厚度1.5 mm的增材碳化硅圆片样品,其密度平均值为2.70 g/cm3,为理论密度的84%.使用3 MeV的Si2+离子在500℃,800℃下将样品辐照至10 dpa,采用透射电子显微镜(TEM)对辐照前后的CVI沉积碳化硅的微观结构进行了表征.结果表明,CVI沉积碳化硅在离子辐照后未见明显的微孔洞和位错环,也没有出现非晶化,表现出良好的辐照稳定性.

Additive manufacturing combining binder jetting(BJ)with chemical vapor infiltration(CVI)is capable of produc-ing high-purity,large-sized,and geometrically complex silicon carbide(SiC),making it a promising candidate for resolving the fabrication challenges of SiC as a nuclear-grade material.However,the microstructural evolution under ion irradiation of SiC produced by this approach,particularly the CVI-SiC,remains insufficiently studied,which limits its development.In this study,SiC powder with an average particle size of 20 μm was used to fabricate additively manufactured SiC(AM-SiC)specimens with a diameter of 20 mm and a thickness of 1.5 mm via the BJ+CVI,which achieved an average density of 2.70 g/cm³.AM-SiC specimens were irradiated with 3 MeV Si²⁺ ions at 500℃and 800℃to 10 dpa.The microstructure of the CVI-SiC before and after irradiation was characterized using transmission electron microscopy(TEM).No significant irradiation-induced voids,dislocation loops,or amorphization were observed in the CVI-SiC after ion irradiation,demon-strating its excellent irradiation stability.

郭帅科;胡逊祥;滕常青;崔丽娟

四川大学 物理学院,四川 成都 610065四川大学 物理学院,四川 成都 610065核能增材制造四川省重点实验室,四川 成都 610213四川大学 物理学院,四川 成都 610065

能源科技

增材制造碳化硅离子辐照微观结构

additive manufacturingsilicon carbideion irradiationmicrostructure

《电焊机》 2026 (4)

98-104,7

增材制造SiC的辐照损伤行为机制研究(JJKJ-2023-JCJQ-07)基于增材制造的碳化硅惰性基体弥散型核燃料元件辐照稳定性研究(SCU&NPIC-LHCX-12)

10.7512/j.issn.1001-2303.2026.04.12

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