沥青基碳纤维改性导热胶膜的制备与性能研究OA

An organosilicon-modified epoxy system was employed as the matrix material for filled thermally conductive adhesive film,with chopped pitch-based carbon fiber(PCF)serving as the thermally conductive filler.A structural-functional integrated adhesive film possessing both favorable adhesion strength and high thermal conductivity was developed,and its structure and properties were analyzed and characterized.The results indicated that silane coupling agents were successfully grafted onto the surface of pitch-based carbon fibers.The surface modified PCF were uniformly distributed in the resin matrix,forming an effective thermally conductive network,which laid a solid foundation for the thermal conduction performance of the adhesive film.When the addition amount of pitch-based carbon fibers reached 50 phr,the thermal conductivity of the adhesive film reached 1.391 W/(m·K),representing an improvement of nearly one order of magnitude compared with the adhesive film without surface modified PCF.Meanwhile,the tensile shear strength of the thermally conductive adhesive film was 18.02 MPa.Additionally,the incorporation of thermally conductive fillers also enhanced the thermal performance of the adhesive film.