基于混合磨粒的石英玻璃化学机械抛光效果试验OA

Objectives:To explore methods for ultra-precise and high-efficiency processing of quartz glass,the influence of the oxidant H2O2 on the dispersion of the mixed abrasive particles is studied,and the material removal mechanism by the oxidant H2O2 and mixed abrasive particles during chemical mechanical polishing(CMP)processing of quartz glass is clarified.Methods:Firstly,the influence law of the oxidant H2O2 content on the dispersion performance of mixed abrasive particles in the polishing solution is analyzed.Then,the effects of H2O2 content and the ratio of mixed abrasive particles on surface processing morphology and removal rate during CMP processing of quartz glass are discussed.Finally,the material removal mechanism at the microscopic scale during CMP is also expounded.Results:When 4%H2O2 solution with a mass fraction is added to the polishing solution,the static stability and spatial steric hindrance between the mixed abrasive particles result in a minimum average particle size(294.1 nm),and the absolute value of the zeta potential increases to a higher value(31.8 mV).The improved dispersion of the mixed abrasive particles reduces the surface roughness Ra of quartz glass to a minimum value(1.12 nm),and the material removal rate reaches 970.45 nm/h.When the ratio of mixed abrasive particles in the polishing solution changes,the material removal rate of quartz glass decreases from 1 455.67 nm/h to 1 238.87 nm/h.When the ratio of mixed abrasive particles in the polishing solution is 1:4,the alternating scratches on the processed surface of quartz glass gradually disappear,and the synergistic effect of the mixed abrasive particles enhances the material removal rate.Conclusions:Mixed abrasive particles adsorb OH-groups on their surfaces to form a protective layer.This protective layer reduces the van der Waals forces and Coulombic forces between the mixed abrasive particles,resulting in high dispersion stability of the polishing solution.The synergistic effect of the mixed abrasive particles enhances their bonding and detachment behavior and optimizes both the material removal rate and surface accuracy.