塑封材料特性对SiC扇出型板级封装热-机械行为的影响研究OA

The high power density and miniaturization trend of SiC devices make the thermo-mechanical properties of epoxy molding compound(EMC)a critical factor determining device performance and reliability.This challenge is particularly pronounced in advanced fan-out panel-level packaging(FOPLP)designs,where the EMC not only serves as insulation but also functions as the primary structural support and a barrier to heat dissipation.To investigate the specific influence patterns of different EMCs on the thermo-mechanical properties of FOPLP,two commercially available EMC systems with distinct filler compositions are selected as research subjects.Their key thermo-mechanical properties are systematically characterized.Subsequently,thermal resistance and thermal warpage experiments are conducted to reveal how material variations affect changes in packaging performance.Simultaneously,a thermo-mechanically coupled finite element analysis(FEA)simulation model of the FOPLP structure is established for simulation validation.The final impact of different EMC types on packaging performance is analyzed,and the accuracy of the constructed FEA simulation model is validated.The research findings demonstrate that the Al2O3-filled EMC exhibits superior thermal resistance and thermal warpage characteristics compared to the SiO2-filled EMC.The constructed FEA model accurately predicts the thermo-mechanical behavior of the package,validating the effectiveness of this integrated experiment-simulation evaluation approach.