混合键合界面力学行为的多尺度仿真:研究进展与挑战OA

Hybrid bonding has emerged as a critical interconnect method enabling high-density 3D heterogeneous integration.The mechanical reliability of its interfaces has a decisive impact on the performance and yield of advanced packaging devices.However,issues such as coefficient of thermal expansion(CTE)mismatch,warpage of ultra-thin wafers,and nanoscale interfacial defects often lead to severe stress concentration,interfacial delamination,and even structural failure.These have become the core factors limiting the large-scale application of hybrid bonding technology.The research progress of multiscale simulation approaches on the mechanical behavior of hybrid bonding interfaces is systematically reviewed.Modeling strategies spanning from the macroscopic continuum scale to the microscopic atomic scale are systematically organized,and the key issues and challenges encountered at each scale of investigation are highlighted.Furthermore,the emerging frontiers are discussed,including quantum-continuum coupled modeling,artificial intelligence(AI)-driven inverse process design,and digital twin-enabled closed-loop optimization.The deep integration of multiscale simulation with intelligent methodologies holds the promise of transforming hybrid bonding development from empirical trial-and-error toward a model-driven paradigm,thereby providing essential mechanical foundations for high-density integration in the post-Moore era.