激光清洗技术在芯片封装模具中的应用OA
Application of laser cleaning technology in chip packaging molds
激光清洗技术作为一种高效、环保的表面处理手段,在芯片封装模具清洗领域具有重要的应用潜力.本文系统探究了激光参数(脉冲宽度、重复频率、平均功率)对基材为P20合金和ASP23合金镀铬的模具表面环氧塑封料(EMC)污染物的清洗效果影响.实验采用1064 nm掺钕脉冲激光器,将高斯光束整形为平顶光束,结合振镜"弓"字扫描路径,以单一变量法优化工艺参数.实验结果表明,激光能量密度为0.55-0.77 J/cm2时,需协同调节脉冲宽度与重复频率,以平衡热输入,可实现污染物完全去除且基材零损伤.参数敏感性分析显示,最佳占空比范围为0.8％～1.0％.此外,功率超过阈值(150 ns,50％或200 ns,50％)会导致基材损伤,表明参数匹配对清洗效果与材料保护至关重要.本研究为芯片封装模具提供了一种高精度、非接触的绿色清洗方案,验证了激光清洗技术在集成电路领域的可行性.
Laser cleaning technology,as an efficient and environmentally friendly surface treatment method,plays significant application potential in the field of chip packaging molds cleaning.This research systematic-ally investigated the effects of laser parameters(pulse duration,repetition rate,average power)on the clean-ing effect of Epoxy Molding Compound(EMC)contaminates from mold surface coated with chromium on P20 alloy and ASP23 alloy substrates.The experiment employed a 1064 nm Nd-doped pulsed laser,reshap-ing the Gaussian beam into a flat-top beam,and combining with a"bow"shape scanning path of the galvano-meter mirror.The process parameters were optimized using a single-variable method.The experimental res-ults indicate that when the laser energy density is in 0.55-0.77 J/cm2,the pulse duration and repetition rate need to be adjusted in coordination to balance the thermal input,enabling complete removal of contaminants without any damage to the substrate.Parameter sensitivity analysis reveals that the optimal duty cycle range is from 0.8％to 1.0％.Furthermore,when the power exceeds the threshold(150 ns@50％average power or 200 ns@50％average power),it may cause damage to the substrate,which indicates that laser parameter matching is crucial for the cleaning effect and material protection.This research provides a high-precision,non-contact and environmentally friendly cleaning solution for chip packaging molds,and verifies the feasib-ility of laser cleaning technology in the field of integrated circuits.
杨金芳;李泽靖;令维军;何涛涛;安浦瑞;杨沛年;袁诗超;毕超;田新叶;汪满;张进兵
甘肃省全固态激光工程研究中心,甘肃天水 741001||集成电路封装测试教育部工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001||甘肃省集成电路封装测试产业研究院,甘肃天水 741001集成电路封装测试教育部工程研究中心,甘肃天水 741001||天水华天科技股份有限公司,甘肃天水 741001甘肃省全固态激光工程研究中心,甘肃天水 741001||集成电路封装测试教育部工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001||甘肃省集成电路封装测试产业研究院,甘肃天水 741001甘肃省全固态激光工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001甘肃省全固态激光工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001甘肃省全固态激光工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001甘肃省全固态激光工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001甘肃省全固态激光工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001甘肃省全固态激光工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001甘肃省全固态激光工程研究中心,甘肃天水 741001||天水师范大学电子信息与电气工程学院,甘肃天水 741001集成电路封装测试教育部工程研究中心,甘肃天水 741001||天水华天科技股份有限公司,甘肃天水 741001
信息技术与安全科学
激光清洗技术芯片封装模具占空比表面处理
laser cleaning technologychip packaging moldduty cyclesurface treatment
《中国光学（中英文）》 2026 (1)
49-59,11
国家自然科学基金(No.62405221,No.62165012)甘肃省高校产业支撑计划项目(No.2024CYZC-44)甘肃省重点人才项目(No.2025RCXM023)甘肃省高校科研创新平台重大培育项目(No.2024CXPT-12)天水市强科技奖补专项项目(No.TS-STK-2024A-277)秦州区科技计划项目(No.2024-SHFZG-8159)甘肃省科技计划基础研究计划项目(No.25JRRE009,No.25JRZE003,No.25JRRE003)甘肃省高校研究生创新之星项目(No.2025CXZX-985)天水师范大学研究生创新引导立项项目(No.TYCX2441)Supported by National Natural Science Foundation of China(No.62405221,No.62165012)Gansu Province University Industry Support Plan Project(No.2024CYZC-44)Key Talent Project of Gansu Province(No.2025RCXM023)Major Cultivation Project of University Research and Innovation Platform of Gansu Provin-cial Department of Education(No.2024CXPT-12)Tianshui Strong Science and Technology Award Special Project(No.TS-STK-2024A-277)Qinzhou District Science and Technology Plan Project(No.2024-SHFZG-8159)Basic Research Program of Gansu Provincial Science and Technology Plan(No.25JRRE009,No.25JRZE003,No.25JRRE003)Gansu Province University Graduate Student Innovation Star Project(No.2025CXZX-985)Postgraduate Research Innovation Guiding Project of Tianshui Normal University(No.TYCX2441)
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