低介电常数光敏聚酰亚胺工艺制程与性能OA

Photosensitive polyimide(PSPI)has important applications in high-density integrated circuits and advanced packaging.Reducing the dielectric constant and dielectric loss of PSPI can effectively reduce signal delay and signal loss during high-frequency high-speed transmission.This paper systematically studies the structural design of low-dielectric-loss photosensitive polyimide and the effects of its light curing and thermal curing processes on its dielectric properties.By manipulating the fluorine-containing groups and alicyclic structures,a series of PSPI with low dielectric constant and low dielectric loss were designed.It reveals the different impacts of various thermal curing temperatures(200～350 ℃)and different processing techniques such as post-light curing and then thermal curing on the dielectric constant and dielectric loss of PSPI.Experimental results show that with high-temperature thermal curing alone,the dielectric constant(Dk)and dielectric loss(Df)of PSPI decrease with increasing curing temperature(Dk=3.1～2.6,200～350 ℃),while samples that are light cured and then thermally cured can also achieve low dielectric constants(Dk=3.0～2.4,200～350 ℃)and low dielectric loss,while maintaining excellent mechanical properties and thermal stability.This study provides a theoretical basis for the structural design and application of high-performance low-dielectric-loss PSPI.