一种可达37GHz的带热沉CQFN外壳的实现OA

This paper proposes a kind of CQFN package with high thermal conductivity heat sink,which can reach 37 GHz.Its dimensions are 7.00 mm×7.00 mm,and the core area is 5.00 mm×5.00 mm.Simulation is used to optimize the size of the RF transmission path to achieve impedance matching.Resonance is suppressed and shielding is enhanced by reasonably arranging ground holes.According to board-level measurement,the return loss of the dual ports of the housing between 10 MHz and 37 GHz is≤-17 dB,the insertion loss is≤1.5 dB,and there is no resonance point in the band.By embedding the CPC141 heat sink with high thermal conductivity,it facilitates timely conduction of heat,meeting the user's high-frequency and high-power packaging requirements.The shell has the characteristics of good high-frequency performance,high integration and good heat dissipation,and can be widely used in the field of high-frequency ceramic packaging.